gratec industrievertretungen GmbH on FESPA Global Print Expo 2022
Dirk Grawunder, Angela Hunger
07.06.2022
The Digital Print Expo FESPA, which took place in Berlin from May 31 to June 03, 2022, was an absolute success with great interest in the user-friendly high-performance adhesive plotters from our partner FELIX LAB and the versatile cutting and creasing plotters from ELITRON. See details below.
In Hall 4.2 Booth A28, ELITRON showed its cutting plotter KOMBO SDC+ in action with numerous new features:
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The new Digital Multi Degree (DMD) cutting module combines large rotating and fixed blades whose angle can be adjusted as desired. This allows you to cut honeycomb panels of any type without effort.
Other improvements shown were:
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New 45° blades for 90° V-cuts.
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A non-stop milling unit with automatic cutter head change
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The automatic centering of the material to be cut in the pre-feeder.
In hall 25, booth B21 our partner FELIX Lab presented the newest high performance glue plotter FELIX GLUER LIGHT, - the world novelty for automation of gluing processes for packaging up to format B0. Several stacks of smaller formats can be fixed with magnetic pins and processed in parallel.
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With the new Windows-based Felix OfficePRO software, setting up the gluing Tracks and points is now even easier.
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With the optional FotoPath, the operator draws the glue lines directly on the photo on the screen. Access control using cards is supported, as is the collection of statistical data needed to calculate profitability.
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Also new is an optional station for pressing the glued folding cartons.
Felix gluing plotters ensure efficiency and precision in any size, even for small quantities.
You too
can benefit from our many years of practical experience with regard to the complex production processes in the packaging industry and let us advise you.